Michael Bell

Michael Bell

Rose-Hulman Institute of Technology Computer Engineering, BS; Mechanical Engineering, BS
NSF Graduate Research Fellow
Harvard Pierce Fellow
Michael Bell
Evolving 3D printed objects from more than metal brackets and plastic toys requires the synergy of engineering disciplines and materials science. With a background in computer engineering, mechanical engineering, robotics and current PhD work in materials science I lead cutting edge research in 3D printed electronics at Harvard. I develop patent-pending machines, processes and materials to 3D print entire electromechanical devices, from simple embedded antennas to entire cell phones using integrated pick-and place technologies.

Contact Information

NWL B148.30